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Press Releases

2009-06-09 15:55 Groundbreaking Technology from Oxford Advanced Surfaces Creates New Industrial Adhesive Promoter Especially for Polymers
2009-06-09 15:54 2nd Asia Bunker Oil Forum 2009 will be Held on June 23-24 in Shenzhen, China
2009-06-09 15:52 Energy Pipeline Asia 2009 will be Held on June 25-26 in Beijing, China
2009-06-09 15:10 Dellis Cay Celebrates the First Anniversary of Its Groundbreaking
2009-06-09 14:00 HDMI Licensing, LLC Releases HDMI Specification Version 1.4
2009-06-09 13:18 Transatlantic Holdings, Inc. Announces Exercise of Underwriters’ Option in AIG’s Secondary Offering of Transatlantic Shares
2009-06-09 11:41 Emirates Airline Partners with GlobalCollect for Introduction of Worldwide Alternative Payment Processing
2009-06-09 11:23 BestWeek Asia/Pacific: Asia’s Frugal Savers a Fertile Field for Insurers
2009-06-09 10:11 Dapagliflozin Study Demonstrated Improved Glycemic Control In Type 2 Diabetes Patients Treated With High Doses of Insulin and Common Oral Anti-Diabetic Medicines
2009-06-09 10:00 Severity of Global Recession and Shrinking Corporate Earnings Cause Sharp Cutbacks in Overseas Assignments, According to Brookfield Global Relocation Services
2009-06-09 10:00 TUV Rheinland Group Acquires International Testing and Certification Services Pty. Ltd. (ITACS)
2009-06-09 09:42 Walton Completes Land Syndication Placements for Walton AZ Silver Reef Limited Partnership 3
2009-06-08 17:09 Pall Corporation Wins Largest Membrane Water Filtration Project in Philippines
2009-06-08 16:00 BlackRock Has Been Engaged in Discussions with Barclays Bank plc
2009-06-08 15:12 Interim Analysis of Long-Term Data with ONGLYZA™ (saxagliptin) When Added to Metformin in People with Inadequately Controlled Type 2 Diabetes Presented at ADA Annual Scientific Sessions
2009-06-08 14:58 Al Fajer Properties Successful Performance Now Measurable
2009-06-08 14:20 Covidien Completes Change in Place of Incorporation
2009-06-08 14:01 deVere & Partners' Global Distribution Alliance with Nomura
2009-06-08 11:29 Premier Farnell’s New CAD Tool Interface, DesignLink, Enables Electronic Design Engineers to Find and Specify Millions of Parts Directly from within the Design Environment
2009-06-08 08:00 INDUSTRY MILESTONE: BMC Software Awarded First Official ITIL® Software Certification